Windup Enhanced Performance and Cooling: Silicone Heatsink Compounds & Non-Conductive CPU Thermal Paste with >1.93W/m-k Thermal Conductivity for PC, CPU, GPU, PS4 (Pack of 2)

Price: ₹499 - ₹299.00
(as of Sep 20, 2024 10:23:10 UTC – Details)

Specially designed for overclocking Specially developed to meet the demanding needs of the overclocking community. It exhibits excellent heat transfer performance and can fully exploit the capabilities of a high-performance cooling system. In the nano-particulate structure, micronized aluminum and zinc oxide contained in the paste interpolate slight unevenness of the heat medium such as CPU and the heat sink, and realize excellent thermal conductivity. The thermal pate special compound that drying does not proceed even at high temperature of 80 ° C is performed, and it does not cure for a long time and maintains stable characteristics. Also, there is no concern about shorts due to non-conductivity.
Optimal Heat Dissipation: ISOL 6 Heat Sink Compound ensures efficient transfer of heat from CPU, chipsets, graphics cards, LED, and IC components.
High Thermal Conductivity: With exceptional thermal conductivity properties, it effectively reduces operating temperatures and prevents overheating.
Reliable Performance: Provides long-lasting thermal stability, ensuring consistent and reliable performance under heavy usage and demanding applications
EASY TO USE:Thermal paste has ideal consistency and is very easy to use even for beginners;it is also not electrically conductive : there is no risk of short-circuits and safe to use with all types of heatsinks
Easy ASAFETY APPLICATION：The is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards.Suitable for CPU radiator or chip. High-temperature resistance, low thermal resistance, and high conductivity can achieve excellent heat transfer. Suitable for CPU, VGA, chipset, and other PC components.pplication: The silicone grease paste is easy to apply, facilitating smooth and even coverage for enhanced heat transfer.