FEDUS Silicone Heatsink Compounds Thermal Grease Paste ISOL 6 Heat Sink Compound for CPU and Chipsets Graphics Card LED IC,Pack of 1

Price: ₹499 - ₹245.70
(as of Sep 25, 2024 11:17:16 UTC – Details)

This Thermal Compound Paste for All Coolers Easy to Apply with an ideal consistency:; very easy to use:; even for beginners.
The possibilities for its application and the most effectively way to avoid voids between CPU and cooler.
Safe Application: It does not contain any metallic particles so electical conductivity would not be an issue.
Unlike silver and copper compound:; it ensures that get with any electrical pins would not result in damage of any sort.
High Thermal conductivity low thermal resistance electrically non-conductive:; non-curing:; non-capacitive:; non-corrosive bleed resistant temp resistant from -50 to 210 C. A high performance thermal compound perfect for system builders.

• Color: Grey
• Thermal Conductivity:> 1.93W/ m-k
• Thermal resistance:> 0.225
• Operating temperature: -30 to 180 Celsius
• Weight: 30g
• Shelf Life: Two years Notice :
• Thermal conductivity : >0.965 W/m-k
• Thermal resistance : <0.225°C-in²/W
• Working temperature range: – 30 ?~ 180 ?

This product has high thermal conductivity:; high insulation:; high temperature bearing:; not easy dried:; non-volatile:; non-toxic:; tasteless:; non-corrosive.
Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors:; diodes and rectifiers
It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis:; thereby increasing the overall efficiency of the component / device
High thermal conductivity low thermal resistance electrically non-conductive:; non-curing:; non-capacitive:; non-corrosive bleed resistant temp resistant from -50 to 210 C