-25%




Price: ₹799 - ₹599.00
(as of Oct 04, 2024 08:11:12 UTC – Details)
R3 250gm White Thermal Heat Sink Compounds are single component modified silicone system. This product finds versatile applications like mounting studs of transistors, diodes and silicone rectify to provide effective heat seal and to improve conductivity at heat sink junctions. It is used as an interface between heat generating components (heat sources) and heat Sinks. It is used to fill the air gaps between the (heat sources) and heat Sinks by applying a thin layer of thermal grease to the top of the microprocessor and the base of the heat sink. Heat sink paste absorb the heat produced by heat sources (high-power semiconductor devices) in all electronic products. Heat Paste is necessary to maintain heat so that all components work smoothly. The main role of Thermal grease is to eliminate air gaps or spaces (which act as thermal insulator) from the interface area so as to maximise heat transfer. Thermal grease is an example of a Thermal interface material.
Exceptional Thermal Conductivity: FEDUS silicone grease offers highly efficient heat transfer, ideal for cooling CPUs and electronic components. It maintains temperature stability and prevents damage.
Versatile Application: Suitable for computer CPUs, PC components, VGA cards, LEDs, heat sinks, graphics cards, and optical devices.
Electrically Safe: Non-conductive to electricity, eliminating the risk of short circuits and providing added protection to electronic devices.
Exceptional Durability: Extremely stable compound resistant to temperature extremes (-52 – 446 °F / -50 – 230 °C) and corrosion, ensuring long-term reliability.
Easy Application: Ideal consistency for easy application without mess, fills gaps effectively. Suitable for beginners; may require a spreader for even distribution.

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