-47%
Price: ₹3,900 - ₹2,072.00
(as of Sep 19, 2024 22:44:09 UTC – Details)
Application:
1.Heat dissipation of electronic appliances, power supply, bonding of transistors.
2.Thermistor heat-dissipating sealing, PTC bonding insulation.
3.Adhesive sealing and heat dissipation with high thermal conductivity.
4.Bonding and sealing of high-power LEDs and lamp beads.
5.Household appliances, electronic components, electricians.
Specification:
Specific quantity: [ 25 ° C (770 F)] > 2.3
Heat transfer coefficient: W/m-k >0.975
Thermal impedance: c-in/W <0.246
Arc resistance: seconds 120
Dry time: [25 °C] 5~15min
Bonding strength: 1.8Mpa
Insulation coefficient: 100Hz/Kvac 5.1 1000Hz/Kvac 5.0
Notes:
1.When using, directly extrude the product, rub it with the surface of the adherend, and cover it immediately after use, in case of trial again;
2.The surface fixed speed is related to the relative humidity and temperature in the air; higher temperature, faster curing speed, and vice versa;
3.The recommended thickness of the application: 0.1-0.5mm, the thinner the better;
4.Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.
Package includes:
3 x Thermal Glue
This heatsink plaster is high thermal conductivity, low leakage and high temperature stability
Apply to 3d printer heatsink, CUP, LED, IC, GPU Chipset, PC Heatsink and all kinds of electronic component that need to be directly bonded firmly
The thermal adhesive is thermal properties, strong adhesion to most metals and non-metals, odorless, non-toxic, moisture-proof, non-swelling, non-corrosive to substrate
Quickly solidifies after exposure to air. Dry time: [25 °C] 5~15min
After-sales guarantee: each defective item can be replacement for free or refund. If any question, please feel free to contact or QA us, we will try our best to service you
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