BUYFLUX Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g)

Original price was: ₹399.00.Current price is: ₹185.00.

16 People watching this product now!

Payment Methods:

Description

BUYFLUX Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g)
Price: ₹399 - ₹185.00
(as of Sep 27, 2024 15:41:17 UTC – Details)



BUYFLUX

This is a heatsink compound (aka thermal grease, thermal paste, thermal goo). Use this whenever you’re connecting a component to a heatsink, it’ll really help to dissipate even more potentially damaging heat. This HY500 series thermal grease offer better cooling performance with high thermal conductivity graphite and powder. This thermal grease should be used to fill the gaps and expanding cooling area between the component and the heat sink.

It has a thermal conductivity of 1.172 W/(mK), which should be plenty for voltage regulators, MOSFETs, motor drivers, audio amplifiers, etc.

Features

Color: Grey
Weight(N.W) 3g (as the picture)
Thermal conductivity > 1.172 W/m-k
Thermal Impedance <0.225
Specific Gravity >2.0
Viscosity 1000
Thixotropic Index 380+_10
Viscosity -50~300
Operation Temperature -30~300
Silicone Compounds 50%
Carbon Compounds 30%
Metal Oxide Compounds 20%
Graphite Thermal Grease,thermal Conductivity 1.93W/m-k~2.15W/m-k
Good Electric Insulating, Breakdown 10Kv voltage
Low Thermal Impedance,Keep grease condition with long time
With a wide range working temperature, keep stable performance at temperature -30~300 High performance

Applications:

Cooling device to the end plate heatsink
High speed and large storage Drives
Automotive Engine controls
Hard disk drive and DVD drives
Power conversion apparatus
High Power LEDs
Notebook and desktop computers
Network Communication Equipment
Household appliances, electronic components, electrical
Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device
High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C
Material : ISOL 6, Heat Sink Compound. Color : Grey
Weight : Approx. 30 g

Customer Reviews

0 reviews
0
0
0
0
0

There are no reviews yet.

Be the first to review “BUYFLUX Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g)”

Your email address will not be published. Required fields are marked *

1 2 3 4 5
1 2 3 4 5
1 2 3 4 5