BUYFLUX Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g) (Set of 2)

Price: ₹499 - ₹275.00
(as of Oct 03, 2024 16:37:13 UTC – Details)

This Thermal Compound Paste for All Coolers Easy to Apply with an ideal consistency, very easy to use, even for beginners. The possibilities for its application and the most effective way to avoid voids between CPU and cooler. Safe Application: It does not contain any metallic particles so electrical conductivity would not be an issue. Unlike silver and copper compound, it ensures that get with any electrical pins would not result in damage of any sort. High Thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C. A high-performance thermal compound perfect for system builders.
Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device
High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C
Material : ISOL 6, Heat Sink Compound. Color : Grey
Weight : Approx. 30 g, Quantity: 2 Piece