-60%


Price: ₹3,626 - ₹1,467.00
(as of Sep 30, 2024 09:43:14 UTC – Details)
* Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink, VGA CARD Northbridge Southbridge Heatsink.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (200°C/392°F / 24Hours)
* Evaporation: 0.001% (200°C/392°F / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: <0.06
* Clotting time: 3min (25°C/77°F
* Strength of connected buildings: 25Kg/55Lb
* Insulation coefficient> 5.1
* Dissipation coefficient <0.005
* Temperature resistance: 200°C/392°F
* Net Weight: 10g
Do Not Use Thermal Glue Between CPU Chip And Heat Sink
Use it within 24 hours once opened
Do Not Use Thermal Glue Between CPU Chip And Heat Sink, use it within 24 hours once opened.
Thermal conductivity:> 1.2W/m-K
Strength of connected buildings: 55 lb.
Features: thermal properties, strong adhesion
Application: apply to all heatsink no fixed clip thermal paste. Ideal for MOSFET Heatsink,VGA CARD Northbridge Southbridge Heatsink.

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