Sadow Pack of 3 Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g)

Price: ₹999 - ₹265.00
(as of Oct 02, 2024 22:03:19 UTC – Details)

Get this Thermal Paste for CPU Thermal Paste for Processor,CPU Thermal Paste, Thermal Paste for Heat Sink, Thermal Grease for CPU, Heat Sink Compound Silicon Conductive for PC CPU GPU Chipset.This is a syringe of heatsink compound (aka thermal grease, thermal paste, thermal goo). Use this whenever you’re connecting a component to a heatsink, it’ll really help to dissipate even more potentially damaging heat. This HY series thermal grease offer better cooling performance with high thermal conductivity graphite and powder. This thermal grease should be used to fill the gaps and expanding cooling area between the component and the heat sink. Features: Color: Grey Thermal conductivity > 1.172 W/m-k Thermal Impedance <0.225 Specific Gravity >2.0 Viscosity 1000 Thixotropic Index 380+_10 Viscosity -50~300 Operation Temperature -30~300 Silicone Compounds 50% Carbon Compounds 30% Metal Oxide Compounds 20% Graphite Thermal Grease,thermal Conductivity 1.93W/m-k~2.15W/m-k Good Electric Insulating, Breakdown 10Kv voltage Low Thermal Impedance,Keep grease condition with long time With a wide range working temperature, keep stable performance at temperature -30~300 High performance Applications: Cooling device to the end plate heatsink High speed and large storage Drives Automotive Engine controls Hard disk drive and DVD drives High Power LEDs Notebook and desktop computers Network Communication Equipment Household appliances, electronic components, electrical Power conversion apparatus
Material : ISOL 6, Heat Sink Compound. Colour : Grey, Packing Type : Injection, Weight : Approx. 30 g
Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device
High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C
Thermal conductivity: >0.965 W/m-k Thermal resistance: <0.225°C-in²/W Working temperature range: - 30 ℃~ 180 ℃ Uses: Thermal coupling of electrical device to heatsinks