Sadow Pack of 4 Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g)

Price: ₹999 - ₹309.00
(as of Oct 04, 2024 17:30:20 UTC – Details)

Product Description

Thermal Grease Paste Compound Silicone for CPU Heat Sink

Thermal coupling of electrical / electronic device to heat sinksHigh Thermal Conductivity:; Low Bleed and Stable at high temperatureSadow silicone-based paste that allows the use of more aluminium in its mix, resulting in better thermal performance and lower operating temperatures

Feature Simple to use. Transfer the dissipated heat from the components to the heat sink. Can be applied for cooling the interface of heatsink and CPU GPU IC Chips Transistors, etc Features optimum thermal conductivity and low thermal resistance.

Thermal Paste

The Heat Sink Paste is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards.Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers.

Clean The Object

Wipe the surface lightly with a cotton ball or cotton swab dampened with isopropyl alcohol. The higher the percentage of alcohol the better. 70 percent is good but 90 percent is better (if you can find it).

Take the heat sink and object surfaces if necessary

Thermal paste is designed to fill in the gaps and imperfections on the surfaces that you are joining. Since modern production techniques cannot make surfaces without imperfections, thermal paste will always be necessary.

Apply Thermal Paste

lace two thin lines of thermal compound on the base of the cooler. The lines should be parallel and spaced so that they are each placed a third of the width of the processor. The lines themselves should also be about a third of the processor’s width in length.

Safe Application

It does not contain any metallic particles so electrical conductivity would not be an issue. Unlike silver and copper compounds, it ensures that contact with any electrical pins would not result in damage of any sort.

Material : ISOL 6, Heat Sink Compound. Colour : Grey, Packing Type : Injection, Weight : Approx. 30 g
Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device
High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C
Thermal conductivity: >0.965 W/m-k Thermal resistance: <0.225°C-in²/W Working temperature range: - 30 ℃~ 180 ℃ Uses: Thermal coupling of electrical device to heatsinks