Scout 6.5W/m-k Thermal Paste Compound with Applicator for CPU/Graphic Cards/Heat sink (Thermal Conductivity: >6.5W/m-k)

Price: ₹1,500 - ₹299.00
(as of Sep 15, 2024 19:06:09 UTC – Details)

Scout silver st-01 3. 5 G thermal paste its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, scout silver st01 provides a new level of performance and stability. It is the premium thermal compound. Performance 3 to 12 degrees centigrade lower cpu full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the cpu core. Coverage area: a 3. 5 Gram syringe contains enough compound to cover at least 15 to 25 small cpu cores, or 6 to 10 large cpu cores, or 2 to 5 heat plates. At a layer 0. 003″ Thick, the 3. 5 Gram syringe will cover approximately 16 square inches. Controlled triple-phase viscosity the suspension fluid is a proprietary mixture of advanced polysynthetic oils that work together to provide three distinctive functional phases. As it comes from the syringe, scout consistency is engineered for easy application. During the cpu’s initial use, the compound thins out to enhance the filling of the microscopic valleys and ensure the best physical contact between the heatsink and the cpu core. Then the compound thickens slightly over the next 50 to 200 hours of use to its final consistency designed for long-term stability. (This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool.
Thermal Conductivity: 6.5W/m-k ( Better than most of the compounds available )
Suitable for: CPU Heatsink, Chip, High Temperature resistance
Low Thermal Resistance and High Conductivity for Heat Transfer – Apply to CPU, VGA, Chipset and other PC components
High Stability and Reliability. Helps disperse the heat from CPU to heatsink effectively