Thermal Grizzly – CPU Contact Frame Intel 13th & 14th Generation – for Optimized CPU Contact Pressure to Improve The Cooling Performance – Easy Install – by der8auer

Price: ₹77,718 - ₹4,298.00
(as of Sep 28, 2024 00:53:11 UTC – Details)

German Engineered – Quality from Berlin The Intel 12th and 13th Gen CPU Contact Frame is an assembly aid that replaces the original Integrated Loading Mechanism (ILM) of the motherboard to enable better cooling performance of CPU coolers through optimized pressure. Due to the changed dimensions of the Intel Alder Lake processors (Intel Core 12th Gen.) and Raptor Lake (Intel Core 13th Gen) for the Intel socket LGA1700 compared to the socket-1200 processors (and older generations, such as socket LGA115X), and the consequent changes in the dimensions of the socket, new mounting brackets for CPU coolers have become necessary. In addition, the standard ILM only has contact points in the middle of the elongated CPU. This results in uneven pressure of the processor into the socket, causing the surface of the Integrated Heatspreader (IHS) to warp concavely, whereby the base plate of the CPU cooler primarily rests on the edges of the IHS and thus the thermal “hotspot” in the middle of the CPU is not covered. Overclocking to the limit The Intel 12th and 13th Gen CPU Contact Frame replaces the ILM of the motherboard. A special inner contour, which relocates the pressure from the center to the edges during assembly, prevents a concave warping of the CPU. This makes the potential contact area with the CPU cooler larger, and especially the “hotspot” can be better covered.
Improved Cooling Performance: This CPU Contact Frame optimizes pressure distribution, enabling enhanced cooling performance of CPU coolers, crucial for maintaining system stability and longevity.
Custom-designed for Intel 12th and 13th Gen CPUs: Specifically engineered to accommodate the changed dimensions of Intel Alder Lake (12th Gen) and Raptor Lake (13th Gen) processors, ensuring a perfect fit for these CPUs on the Intel socket LGA1700.
Replaces Original Integrated Loading Mechanism (ILM): This assembly aid seamlessly replaces the motherboard’s original ILM, providing a more efficient cooling solution for your CPU.
Prevents Uneven Pressure and Concave Warping: Its unique design applies pressure evenly across the CPU’s surface, preventing the concave warping often caused by the standard ILM. This ensures the entire CPU surface, especially the critical “hotspot”, is covered for optimal cooling.
Supports Maximum Overclocking: By enhancing CPU cooler performance and ensuring even coverage, this product allows for overclocking to the limit, enabling you to maximize your CPU’s potential safely and effectively.