Thermal Paste 1.9W/mK 1KG, TG-S606B Silicone-Type Grease, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU

Price: ₹50,205 - ₹45,640.00
(as of Oct 04, 2024 06:06:10 UTC – Details)

Specification:
Thermal Conductivity: 1.9±10%W/mK
Oil Dispersible: <0.2 wt%
Density: 2.2±5%g/cm³
Working Temperature: -40~180°C
Volume Resistance: >10^11
*TG-S606B is a thermal grease with 1.9W/MK thermal conductivity. The fluidity of this product is quite good. It can also fill up the very low thermal resistance of the contact interface itself segregated. Since this is a cost-competitive thermally conductive material, if such high thermal conductivity is not required and there is only a low budget for cost considerations, this type of product is highly recommended.
Application:
Electronic components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic products, Energy Storage, Industrial, Lighting equipment, Medical, Military, Netcom, Panel, Power electronics, Robot, Servers, Smart Home, Telecom, etc.
Features:
High thermal conductivity
Good leveling agent
No overflow
Effectively fill the gap of the interface
Low thermal impedance/thermal resistanceSilicone base, no Environmental pollution
Operating Manual:

1.Find a high-purity solvent and cloth.
2.Wipe the surface of the CPU and the entire heat sink assembly.
3.Use the center-point application method.
4.Spread the thermal paste evenly
5.Put the cover back on the heat sink

Storage:

Store in a cool, dry place away from direct sunlight.
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