Thermal Paste 5.3W/mK 1KG, TG-S606C Silicone-Type Grease, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU

Price: ₹97,660 - ₹88,780.00
(as of Oct 03, 2024 17:43:11 UTC – Details)

Specification:
Thermal Conductivity: 5.3±10%W/mK
Oil Dispersible: <0.05 wt%
Density: 2.95±5%g/cm³
Working Temperature: -40~180°C
Volume Resistance: >10^12
*S606C is a thermal grease with 5.3W/MK thermal conductivity this grease also known as the thermal paste is mainly used to assist heat sinks, commonly used computer IC wafers to dissipate heat, etc., because it can be used to apply only a thin layer, it can reach 1mm in the thinnest case, the maximum extent Reduce the thickness of the thermal interface material, so the thermal resistance can be minimized.
Application:
Electronic components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic products, Energy Storage, Industrial, Lighting equipment, Medical, Military, Netcom, Panel, Power electronics, Robot, Servers, Smart Home, Telecom, etc.
Features:
High thermal conductivity
Good leveling agent
No overflow
Effectively fill the gap of the interface
Low thermal impedance/thermal resistanceSilicone base, no Environmental pollution
Operating Manual:

1.Find a high-purity solvent and cloth.
2.Wipe the surface of the CPU and the entire heat sink assembly.
3.Use the center-point application method.
4.Spread the thermal paste evenly
5.Put the cover back on the heat sink

Storage:

Store in a cool, dry place away from direct sunlight.
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