MERISHOPP 1g High Performance Conductonaut Liquid Metal Thermal Paste Heatsink Paste | Computers/Tablets & Networking | Computer Components & Parts | Fans, Heat Sinks & Cooling

Original price was: ₹6,736.00.Current price is: ₹2,732.00.

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Description

MERISHOPP 1g High Performance Conductonaut Liquid Metal Thermal Paste Heatsink Paste | Computers/Tablets & Networking | Computer Components & Parts | Fans, Heat Sinks & Cooling
Price: ₹6,736 - ₹2,732.00
(as of Sep 26, 2024 02:50:11 UTC – Details)



Description:
Conductonaut is a high performance liquid metal thermal compound, designed for applications that require very high efficiency.
Liquid metal thermal compound is based on a eutectic alloy. A special combination of metals like tin, gallium and indium results in very high thermal conductivity and excellent long-term stability.
Recommended for experienced users who are looking for a top performance product with best heat dissipation where temperature ranges are above 10 °C.
Ultra high thermal conductivity, increased indium content, Easy application with synthetic needle
Recommended for applications that require extremely high thermal conductivity at room temperature – e.g. between a silicon chip PC microprocessor and heat sink.

Specification:

Size: 120mm x 60mm x30mm/4.7 x 2.4 x 1.2 inch
Specific gravity: 6.24g/cm3
Working temperature: 10°C-140°C
Thermal conductivity: 73W/mK
Shape: liquid
Color: silver
Applications: CPU, GPU,Notebook computer, IC

Package Includes:
1x Liquid Metal Thermal Compound.
Note:
It should be stored boxed and under dry conditions at room temperature.
Conductonaut is a high performance liquid metal thermal compound, designed for applications that require very high efficiency.
Liquid metal thermal compound is based on a eutectic alloy. A special combination of metals like tin, gallium and indium results in very high thermal conductivity and excellent long-term stability.
Recommended for experienced users who are looking for a top performance product with best heat dissipation where temperature ranges are above 10 °C.
Ultra high thermal conductivity, increased indium content, Easy application with synthetic needle
Recommended for applications that require extremely high thermal conductivity at room temperature “ e.g. between a silicon chip PC microprocessor and

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